Abstract |
| The growing development and demands for processing power in the electronic industry requires enhanced processor performance to facilitate faster operations. The requirement for cooling techniques to dissipate the associated heat is of utmost importance. It is highly desirable to explore high-performance cooling devices, especially for CPU cooling. Thus, heat pipes are regarded as a promising way for cooling electronic equipments. A comprehensive review of studies on various types of heat pipes used for cooling the electronic equipments has been presented in this paper. The components of heat pipe such as wick structure, working fluids and vapor flow are reviewed in detail. Advantages of nano-fluids and metal nano-particles towards the thermal performance are also elaborated. All the experimental, analytical and numerical approaches and the evolution of heat pipes from the past to the latest work are addressed. Accordingly, conventional and new types of heat pipes with their applications for electronic cooling in general and the computer cooling in particular are elaborated. Summary tables which compare the content, methodology and types of heat pipes are also presented. The conclusions and recommendations for future investigations are highlighted in the final section of this paper. |
Keywords and phrases
heat pipes, wick structure, working fluids, electronic cooling.
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